TOPE PRODUCTS
HBOND SERVICE
- Tape name
- Tape Model
- Tape Specifications
- bonding sheet
- ZH-BS
- 500/250MM*100M
Bonding sheet is a kind of high performance epoxy-based adhesive which formulated for the requirement of anti-migration, weatherbility, flexibility, flammability, and heat resistance. Bonding sheet is especially designed to made a balance between the highest peel strength needs and easy-operating when laminating. It is an ideal adhesive material for PCB、FPC or similar application.
Easy to Process by Roll Lamination plus Postcure.
Excellent Moisture Resistance.
Appropriate for Bonding Polyimide film Base FPC to Stiffener
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6 months: When storing in original carton at 5℃. |
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3months: When storing in original carton at 5℃.~20℃,H70% |
包裝Availability
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Standard product per roll: 250mm or 500mm in width, 100m in length. We can also provide customized products. |
纯胶性能参数 Characteristic of Ad
Test Item |
Unit |
Treatment conditions |
Roll lamination |
Press-bonding |
Resin Flow |
mm |
A |
0.01(Max) |
0.15(Max) |
Peel strength |
N/mm |
A |
2.3 |
2.4 |
After immersion in chemical |
1.9 |
2.1 | ||
Solder Heat Resistance |
-- |
288℃/10sec. |
Pass |
Pass |
Water Resistance Peel Strength |
Kgf/cm |
A |
1.4 |
1.6 |
Note
1. Value of Resin Flow, Peel Strength and Solder Heat Resistance are those of Laminate using AD (40μm) as adhesive in press-bonding polyimide film (50μm) with unclad FPC.
2. Value of Water Resistance Peel Strength is that of laminate using AD as adhesive in press-bonding polyimide film (75μm) with polyimide surface of FPC treated in solution of 3% NaOH at 40℃ for 150 sec.
Roll Lamination Method
Lamination Conditions Roll surface temperature 100℃
Lamination Speed 1M/min
Lamination Pressure 0.8kg/cm
Plus postcure (80℃/ 2hrs plus 160℃/1hr)
Press-Bonding Method: Press conditions (160℃ / 40min, 40kg/cm2)
使用方法Handing
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Name | Model | Color |
adhesive
type |
thickness
adhesive |
standard size | property | ||||
total
thickness
μm |
width
mm |
length
m |
90°peeling
strength |
excessive glue | heat resistant | |||||
μm | Kgf/cm(PI/SUS) | (R.F)mm | ℃ | |||||||
bonding sheet | ZH-BS12 | Transparent(white) | epoxy-based adhesive | 12 | 12±2 | 250/500 | 100 | 2.1~2.5 | <0.2 | 288℃/10sec pass |
ZH-BS15 | Transparent(white) | 15 | 15±3 | 250/500 | 100 | 2.2~2.6 | <0.2 | 288℃/10sec pass | ||
ZH-BS20 | Transparent(white) | 20 | 20±3 | 250/500 | 100 | 2.3~2.6 | <0.2 | 288℃/10sec pass | ||
ZH-BS25 | Transparent(white) | 25 | 25±3 | 250/500 | 100 | 2.4~2.8 | <0.2 | 288℃/10sec pass | ||
ZH-BS35 | Transparent(white) | 35 | 35±3 | 250/500 | 100 | 2.5~2.9 | <0.2 | 288℃/10sec pass | ||
ZH-BS40 | Transparent(white) | 40 | 40±3 | 250/500 | 100 | 2.6~3.0 | <0.2 | 288℃/10sec pass | ||
ZH-BS50 | Transparent(white) | 50 | 50±3 | 250/500 | 100 | 2.7~3.3 | <0.2 | 288℃/10sec pass |
Tape Knowledge
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